In 2016, around 20,000 people have visited the #Automotive exhibition sector. To get the latest insights from the automotive industry stop by electronica 2018: https://t.co/cmyAOAVn2K #Techfacts #ele18 pic.twitter.com/tMiTsXMiv3
— electronicaFair (@electronicaFair) October 10, 2018
“Electronics and software already account for over 90 percent of all “automotive” innovations. In addition to autonomous and connected driving, the electrification of the drive train is also ensuring that this trend continues. (…) The value of the microelectronic systems in each vehicle is increasing too. According to the recent microelectronics trend analysis carried out by the Zentralverband Elektrotechnik- und Elektronikindustrie (ZVEI), it will increase from $477 last year to $535 in 2022. As a result of this, global sales of vehicle semiconductors are expected to increase from $45.5 billion in 2017 to $53.4 billion in 2022.”
— electronicaFair (@electronicaFair) September 6, 2018
Diving into the world of mobility:
During pre-day of #ele18 literally everything is moving forward – fully-charged program at electronica Automotive Conference #eAC.#EmissionFreeDriving #AutonomousDriving #AssistedDriving #AI #LastMile #emobility #sensors pic.twitter.com/MCbs6e9nBR
— mindrockets 🚀 (@mindrockets) November 12, 2018
How are #MEMS sensors going to enable future automotive systems? Visit the electronica Automotive Conference at ICM Munich and attend the session with Markus Sonnemann! Check out the program: https://t.co/uUQOzFE2ue @electronicaFair #BoschMEMS #Bosch_electronica pic.twitter.com/K6ZLF8cmuU
— Bosch MEMS DE (@BoschMEMS) November 11, 2018
Bert Bergner, TE Connectivity, presented “High-Speed Data Requirements for Autonomous Driving“. Future vehicle architectures will require high-speed data links of 10 Gbps and higher.
Connecting cars to the future requires a new generation of #technology. Discover the new capabilities paving the way for a revolutionized driving experience. #CartoCloud https://t.co/eTHips458M pic.twitter.com/wm7H2g333z
— TE Connectivity (@TEConnectivity) November 12, 2018
Mr Bergner identified data capacity limitations depending on link topology, cabling component performance, EMC and margin needs as well as economic solutions for high-speed links considering these effects and discussed possible effects on the value chain.
“Are small entities, start-ups, “think tanks”, … the „better“, faster, more innovative future for the Automotive industry?” was discussed as the main question the center of the discussion panel. Participants on the stage were Andreas Unseld, UnternehmerTUM Venture Capital Partners, Lars Reger, NXP Semiconductors, Jörg Brandscheid, Continental, Rudolf von Stokar, auroralabs, Nakul Duggal, Qualcomm Technologies, Peter Gresch, OptE GP Consulting, and Matthias Kreimeier, e.GO Moove.
— electronicaFair (@electronicaFair) November 11, 2018